Photonics Advanced Packaging Engineer

imec

Nanobiotechnologies

5611 Eindhoven, Noord-Brabant - Niederlande

Chef de projet / Expert confirmé

Experteer Overview

In this role you lead laser integration and packaging for integrated photonics, collaborating with internal and external partners to define packaging paths. You drive operational packaging workflows, develop next‑gen packaging technologies, and evaluate architectures for performance, cost, and manufacturability. You will own packaging campaigns, validate packaged chips in the lab, and share insights to mature packaging practices. This position offers impact across photonics applications and a chance to shape scalable packaging solutions.

Rémunérations / Avantages

100% employer-paid pension plan
flexible working hours
training opportunities
relocation support
international work environment
opportunity to impact future technologies

Responsabilités

Lead development of laser integration and packaging for integrated photonics, focusing on III–V to Silicon (Silicon Nitride) paths
Own and manage packaging workflows with internal teams and external partners
Create new packaging paths to improve operational excellence and meet new demands
Establish and improve design-for-packaging guidelines (optical, electrical, thermal)
Develop next‑generation packaging and integration technologies
Evaluate packaging architectures for performance, cost, and manufacturability
Plan, schedule, and execute packaging campaigns including yield analysis
Demonstrate and validate packaged chips in a lab environment
Share insights with the team and contribute to packaging maturity
Prepare technical notes and documentation; optionally file patents or publish work

Principales exigences

MSc with 4+ years of experience or PhD in EE, physics, photonics, or ME
Hands-on experience with semiconductor laser packaging (fiber coupling, butt coupling, laser assembly)
Solid understanding of laser-related packaging processes
Desirable: strong knowledge of electrical packaging and opto-electronic integration
Plus: on‑chip laser coupling awareness
Industry experience in photonics packaging; strong academic experience considered
Experience with packaging design and mechanical CAD tools (e.g., SolidWorks 3D)
Experience with high-speed interconnects; PIC design/characterization a plus
Familiarity with photonic simulation tools (e.g., FDTD) a plus
Project management skills a plus
Strong written and verbal English communication

self-driven ability to work with ambiguity effective communicator semiconductor laser packaging fiber coupling butt coupling

Description du poste

In this role you lead laser integration and packaging for integrated photonics, collaborating with internal and external partners to define …

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