Principal Packaging Engineer
Chasseur de têtes: Intellectual Capital Resources
Sous-traitants
Newport - Großbritannien
Chef de projet / Expert confirmé
Experteer Overview
In this role you will lead the development of advanced 3D/2.5D packaging solutions for AI applications, driving prototypes from concept to testing. You will shape technology roadmaps and manage multiple packaging projects, collaborating across teams to solve system-level integration challenges. You will represent the company in technical forums and collaborative bids. This is a strategic, hands-on opportunity to deliver next-generation packaging and impact-scale projects.
Rémunérations / Avantages
- Salary up to £74,000
- Pension 15% (employer 10%)
- Annual bonus
- Private medical insurance extended to family
- Visa sponsorship and relocation support up to £5,000
Responsabilités
- Lead and architect 3D/2.5D packaging solutions from concept to prototype
- Oversee design, assembly, testing, and validation of packaging demonstrators
- Define technology roadmaps and guide multiple packaging projects
- Collaborate with internal and external teams on system-level integration
- Represent the company in technical forums, proposals, and collaborative bids
Principales exigences
- Proven experience in advanced semiconductor packaging – 3D/2.5D
- Strong knowledge of design, modelling, assembly, and validation processes
- Skilled in signal/power integrity and thermal management
- Excellent communication, leadership, and problem-solving skills
- Track record of delivering demonstrators and leading cross-functional teams
Description du poste
In this role you will lead the development of advanced 3D/2.5D packaging solutions for AI applications, driving prototypes from concept to t…
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